Cubot KingKong ES 3 vs hotwav T7 Pro

Sakilas

Merek: Cubot; Hotwav
Tanggal rilis: Juli 2025, 11 sasi kepungkur; Juni 2024, 2 taun kepungkur
AnTuTu: 225.000 Antutu v10 Overall performance better than 56% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Ukuran: 6.74"; 6.6"
Resolusi: 720 x 1612 px HD+; 1080 x 2460 px FHD+
Jinis: LCD IPS; LCD IPS
Kepadhetan: 269 ppi Medium Density; 407 ppi Very high density
Rasio aspek: 20:9; 21:9
Fitur: Water Drop Notch, Refresh rate 90 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: Unisoc Tiger T606; MediaTek MT8788V
CPU: 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Jinis CPU: Octa-Core; Octa-Core
Proses: 12 nm; 12 nm
Frekuensi: 1.6 GHz; 2 GHz
GPU: ARM Mali-G57; Mali-G72 MP3
RAM: 6 GB; 6 GB
Jinis RAM: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolusi: 48 Mpx; 64 Mpx
Aperture: Unknow; Unknow
Flash: Dual LED; LED
Stabilisasi optik: No; No
Gerak alon: No, 30 fps; No, 30 fps
Fitur: Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, HDR, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Kapasitas: 256 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Jinis: —; eMMC 5.1 Storage

Dimensi: 78.3 mm 162.5 mm 13.3 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Bobot: 284 g; 292 g
Bahan: Rugged Smartphone, Metal; Rugged Smartphone, Plastic , Faux leather
Warna: Black Orange; Black Orange
Tahan banyu/bledug: IP68, IP69; IP68, IP69 , MIL-STD-810H
Tahan tiba: Class A B C D E 90 drops without defects; Class A B C D E 270 drops without defects
Kemampuan ndandani: Class A B C D E; Class A B C D E
Permukaan sing bisa dianggo: 73 %; 71 %

Sistem operasi: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Layanan Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0; Bluetooth 5.0 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fitur Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fitur USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)