Cubot Kingkong Mini 4 vs hotwav T7

Sakilas

Merek: Cubot; Hotwav
Tanggal rilis: November 2025, 7 sasi kepungkur; Juli 2024, 1 taun 11 sasi kepungkur
AnTuTu: 285.000 Antutu v9 Overall performance better than 61% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Ukuran: 4.7"; 6.6"
Resolusi: 720 x 1600 px HD+; 1080 x 2460 px FHD+
Jinis: LCD IPS; LCD IPS
Kepadhetan: 373 ppi High Density; 407 ppi Very high density
Rasio aspek: 20:9; 21:9
Fitur: Hole-punch Notch, Glove touch support, Color LED Notifications, Scratch resistant, Capacitive, Multi-touch; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: Unisoc Tiger T616; MediaTek MT8788V
CPU: 2 x ARM Cortex A75 2.0Ghz + 6 x ARM Cortex A55 1.8Ghz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Jinis CPU: Octa-Core; Octa-Core
Proses: 12 nm; 12 nm
Frekuensi: 2 GHz; 2 GHz
GPU: Mali-G57 MP1; Mali-G72 MP3
RAM: 6 GB; 4 GB
Jinis RAM: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolusi: 48 Mpx; 21 Mpx
Aperture: ƒ/ 1.8; Unknow
Flash: LED; LED
Stabilisasi optik: No; No
Gerak alon: No, 30 fps; No, 30 fps
Fitur: Digital zoom, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony Exmor

Kapasitas: 128 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Jinis: —; eMMC 5.1 Storage

Dimensi: 61.0 mm 128.7 mm 16.8 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Bobot: 192 g; 292 g
Bahan: Rugged Smartphone, Polycarbonate; Rugged Smartphone, Plastic , Faux leather
Warna: Black Red Green Orange; Black Orange
Tahan banyu/bledug: IP68, MIL-STD-810G , IP69; IP68, IP69 , MIL-STD-810H
Tahan tiba: Class A B C D E 270 drops without defects; —
Kemampuan ndandani: Class A B C D E; —
Permukaan sing bisa dianggo: 68 %; 71 %

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fitur Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fitur USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)