iiif150 Air1 Pro vs Sony Xperia 10 VI

Sakilas

Merek: iiiF150; Sony
Tanggal rilis: Juni 2022, 4 taun kepungkur; Mei 2024, 2 taun 1 sasi kepungkur
AnTuTu: 160.000 Antutu v10 Overall performance better than 54% of devices; 512.000 Antutu v10 Overall performance better than 73% of devices

Ukuran: 6.5"; 6.1"
Resolusi: 1080 x 2400 px FHD+; 1080 x 2520 px FHD+
Jinis: LCD IPS; Oled
Kepadhetan: 405 ppi Very high density; 449 ppi Very high density
Rasio aspek: 20:9; 21:9
Fitur: Hole-punch Notch, LED Notifications, Scratch resistant, Corning Gorilla Glass, Capacitive, Multi-touch; Without Notch, 60 Hz refresh rate, Touch sampling rate 120 Hz, DCI-P3, 100% NTSC, Triluminos display for mobile, 10 Bits panel, Scratch resistant, Corning Gorilla Glass Victus, Capacitive, Multi-touch, Frameless

Resolusi: 45 Mpx; 48 Mpx
Aperture: ƒ/ 1.8; ƒ/ 1.8
Flash: Triple LED; LED
Stabilisasi optik: No; Yes
Gerak alon: No, 30 fps; No, 30 fps
Fitur: Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Night Vision; Digital zoom, Dual camera, Digital image stabilization, Optical Stabilization (OIS), Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, RAW
Sensor: —; Sony IMX582 Exmor RS
Ukuran piksel: —; 0.80 µm
Ukuran sensor: —; 1/2.96"

Kapasitas: 128 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Jinis: —; UFS Storage

Dimensi: 81.6 mm 171.0 mm 11.3 mm Print 3D Model; 68.0 mm 155.0 mm 8.3 mm Print 3D Model
Bobot: 272 g; 164 g
Bahan: Rugged Smartphone, Polycarbonate , Titanium; Plastic
Warna: Black Orange; Black Gray Cyan
Tahan banyu/bledug: IP68, MIL-STD-810G , IP69; IP68, IP6X , IPX8
Permukaan sing bisa dianggo: 73 %; 82 %

Sistem operasi: Android 11 Red Velvet Cake Android 11; Android 14 Upside-down cake Android 14
Layanan Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + eSIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.2 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), AVRCP (Audio/Visual Remote Control Profile), DIP (Device ID Profile), GAVDP (Generic Audio/Video Distribution Profile), GAP (Generic Access Profile), HFP (Hands-Free Profile), HID (Human Interface Profile), HSP (Headset Profile), LE (Low Energy), MAP (Message Access Profile), PAN (Personal Area Networking Profile), SPP (Serial Port Protocol), OPP (Object Push Profile), PBAP/PAB (Phone Book Access Profile), HDP (Health Device Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fitur Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fitur USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, QZSS, Galileo

4G LTE: B1 (2100), B3 (1800), B7 (2600), B8 (900), B19 (800), B20 (800); B1 (2100), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B8 (900); B1 (2100), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n20 (800), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n77 (3700), n78 (3500), n79 (4700)